DG-UV5W

Applicable materials: Apply to glass, polymer materials and other body surface of the standard, micro-hole processing. Applicable Industries: Widely application to marking on packing materials of food, medicine, cosmetics and wire, drilling tiny hole (hole diameter D≤10 um)Flexible PCB,TFT marking and slicing. Metallic and non metallic materials thin film removal. Silicon wafer tiny hole and dead hole processing.

1.Stable performance, small size, low power consumption 2.Excellent beam quality, high stability output, laser easy to debug the marking effect. 3.High electro-optical conversion efficiency, long useful period. 4.The operating system is flexible and convenient.