Détails essentiels
Poids brut:220 kg
Poids net:200 kg
numéro de spécification:DG-UV5W
Introduction du produit
wholesale customized 3d laser marking machine
Description
3D marking machine has revolutionary design ,can be engraved on the XYZ axis . for any shape of any size products can match the high quality,high precision marking.
suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials.
Advantages
1.It can mark on 3D curved surface, generate precise laser spot and have uniform marking quality within the scope of 0~100mm height
2..Adopted with advanced triaxial digital galvanometer scanner, it can realize fast marking, real-time control of variable focal length and uniform laser spot;
3.The marking software can import chart exported from the mainstream 3D software, manage 3D graphics edit with simple way and convert 2D graphics to 3D, easy operation.
Specfiaction
| machine model | DG-HSC3D |
| Laser power | 5W |
| Laser wavelength | 355nm |
| Power Consumption | 120cw |
| Size for main body | 560mmX820mmX1450mm |
| Size for supply cabinet | 650mmX650mmX880mm |
| Environment requirements | ambient temperature15-35℃/ humidity30-80% |
Applicable materials:
mainly used for super precise marking and engraving, particularly suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials, etc.
