Applicable materials:
Apply to glass, polymer materials and other body surface of the standard, micro-hole processing.
Applicable Industries:
Widely application to marking on packing materials of food, medicine, cosmetics and wire, drilling tiny hole (hole
diameter D≤10 um)Flexible PCB,TFT marking and slicing. Metallic and non metallic materials thin film removal.
Silicon wafer tiny hole and dead hole processing.
Product Features:
1.Stable performance, small size, low power consumption
2.Excellent beam quality, high stability output, laser easy to debug the marking effect.
3.High electro-optical conversion efficiency, long useful period.
4.The operating system is flexible and convenient.