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Wprowadzenie produktu
umshini wokumaka wengilazi ongu-355nm we-uv we-laser oqoshiwe ophathwayo abakhiqizi
Incazelo
Umshini wokumaka we-UV laser usebenzisa i-semiconductor end-pumped laser ukuze ukhiqize i-laser ye-UV engu-355nm ngokusebenzisa isizukulwane sesithathu se-harmonic. Inezinga eliphezulu lokuguqulwa kwesithombe sikagesi kanye nesixhumi esibonakalayo esisebenziseka kalula, okwenza kube lula ukuyisebenzisa. Izinto zokusebenza zinokuzinza okuhle kakhulu, futhi uhlobo lwe-galvanometer-ikhanda lokumaka ukunemba okuphezulu liqinisekisa umphumela omuhle wokumaka. Ubude begagasi obuphumayo obungu-355nm buhlala isikhathi eside, bunciphisa umthelela oshisayo endaweni yokusebenza.Izinzuzo
Ukusebenza okuzinzile, usayizi omncane, ukusetshenziswa kwamandla okuphansi
Ikhwalithi ye-beam enhle kakhulu, ukuphuma kokuzinza okuphezulu, i-laser kulula ukulungisa umphumela wokumaka.
Ukusebenza kahle kokuguqulwa kwe-electro-optical, isikhathi eside esiwusizo.
Uhlelo lokusebenza luyaguquguquka futhi lufanelekile.
Ukucaciswa
Ukusebenza/imodeli | iyunithi | I-DG-UV3W | I-DG-UV5W |
Amandla e-laser | IN | 3W | 5W |
Ubude begagasi | nm | 355nm | |
Uhlamvu oluncane | mm | 0.15 | |
Phinda ukunemba | mm | ±0.002 | |
Ikhwalithi ye-Beam(M²) | <1.2 | ||
I-modulating frequency | KHZ | 25-100 | |
Ukumaka ububanzi | mm | 100×100/150×150/200×200(Ongakukhetha) | |
Isivinini sokumaka | ≤7000 | ||
Indlela yokupholisa | /Ukupholisa amanzi | ||
Isistimu yamandla | 220V±5%/20Hz/5A | ||
Izidingo zamandla | <500 | <600 |
Izinto ezisetshenziswayo:
ifanele imakethe esezingeni eliphezulu yokucubungula okuhle ngemishini yokumaka ye-ultra precision ultraviolet laser, ukumaka okungaphezulu kwamabhodlela okupakisha izimonyo, izidakamizwa, ukudla, nezinye izinto ze-polymer kunembile, okumaka okucacile nokuqinile, kudlula ukuphrinta kukayinki nokungcola. -mahhala; Ukumaka nokubhala kwebhodi le-PCB okuguquguqukayo; I-Silicon wafer micro hole kanye nokucutshungulwa kwembobo eyimpumputhe.